2024 ECTC
Scientech will join 2024 ECTC.
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The Polar/Single series represents an advanced system for treating individual semiconductor wafers, widely used in FEOL processes to leverage the output quality. Compared to batch processing methods, single-wafer tools offer notable benefits such as superior process control, customization, decreased contamination risk, and enhanced yield. Single-wafer systems are versatile, can be applied to various applications, and are integrated with features like ...More
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Wet batch systems process multiple wafers simultaneously and are widely used in BEOL processes, including cleaning, etching, and plating. Batch processing offers advantages in terms of throughput and efficiency, making it well-suited for high-volume applications. The equipment optimizes performance by using automated handling, precise chemical delivery, and control systems. Safety measures and waste treatment are integrated to ensure responsible ...More
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PR Stripper (soak and spray module) is a hybridized tool designed to generate a high-quality output as a single wafer process while maintaining a high yield quantity as a bench process. It provides the ability to monitor and control the process of a specific individual wafer or a desired set of wafers. Furthermore, it allows for the concurrent usage of wafers of various sizes, such as 8-inch and 12-inch wafers, effectively eliminating solid and liquid film-resist ...More
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Temporary bonding and debonding are essential processes in semiconductor manufacturing. This technology involves temporarily bonding a device wafer to a carrier wafer using an intermediate material, which provides physical stability for thin wafers or wafers to be trimmed during processing. This allows the delicate device wafer to be processed with additional mechanical support. The wafer and carrier are debonded once the necessary processing steps ...More
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